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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 261147Generated: November 2, 2026

Sulfuric Acid → HCID 86736610, compound

https://huagongshe.com/reaction/261147

Reaction equation

Participants

RoleNameHCIDCharge
ReactantSulfuric AcidHCID 1118—
ReactantCopperHCID 23978—
ReactantCopper sulfate pentahydrateHCID 24463—
SolventCopper SulfateHCID 24462—
ProductHCID 86736610HCID 86736610—

Reaction Steps

One liter of a copper sulfate-sulfuric acid slurry was prepared by adding copper sulfate pentahydrate crystals to an aqueous solution which contained 15 percent by volume free sulfuric acid (66° Baume) and was saturated in copper sulfate at 67° F. (29.2 g/l Cu). Initially at rest, the crystal fraction comprised about 40 percent of the total slurry volume. This slurry was agitated mechanically and heated to 150° F. while copper was plated at a current density of 160 amps per square foot. A stainless steel cathode was used with lead anodes. After one hour of plating under these conditions, the cathode was removed and inspected. The copper deposit was relatively smooth and fine grained in nature.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS04164456
Source datasetuspto-grants-1979_08
ORD IDord-0ca82fabeaae4bd38a5c99ef97beee2a
Source noteuspto-grants-1979_08