HuagongsheHuagongshe Chemistry Print Report · For research reference only
Sulfuric Acid → HCID 86736610, compound
Participants
| Role | Name | HCID | Charge |
|---|---|---|---|
| Reactant | Sulfuric Acid | HCID 1118 | — |
| Reactant | Copper | HCID 23978 | — |
| Reactant | Copper sulfate pentahydrate | HCID 24463 | — |
| Solvent | Copper Sulfate | HCID 24462 | — |
| Product | HCID 86736610 | HCID 86736610 | — |
Reaction Steps
One liter of a copper sulfate-sulfuric acid slurry was prepared by adding copper sulfate pentahydrate crystals to an aqueous solution which contained 15 percent by volume free sulfuric acid (66° Baume) and was saturated in copper sulfate at 67° F. (29.2 g/l Cu). Initially at rest, the crystal fraction comprised about 40 percent of the total slurry volume. This slurry was agitated mechanically and heated to 150° F. while copper was plated at a current density of 160 amps per square foot. A stainless steel cathode was used with lead anodes. After one hour of plating under these conditions, the cathode was removed and inspected. The copper deposit was relatively smooth and fine grained in nature.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patent number | US04164456 |
| Source dataset | uspto-grants-1979_08 |
| ORD ID | ord-0ca82fabeaae4bd38a5c99ef97beee2a |
| Source note | uspto-grants-1979_08 |