Sulfuric Acid → HCID 86736610, compound

HRID 261147Notes

Reaction equation

HRID 261147 reaction equation
O.O.O.O.O.[S:6]([O-:10])([O-:9])(=[O:8])=[O:7].[Cu+2:11].[S:12](=[O:16])(=[O:15])([OH:14])[OH:13].[Cu]>S([O-])([O-])(=O)=O.[Cu+2]>[S:6]([O-:10])([O-:9])(=[O:8])=[O:7].[Cu+2:11].[S:12](=[O:14])(=[O:13])([OH:16])[OH:15]

Participants

5

Reactant 3

HCID 1118Sulfuric AcidHCID 23978CopperHCID 24463Copper sulfate pentahydrate

Product 1

HCID 86736610HCID 86736610, compound

Reagents, catalysts & solvents 1

HCID 24462Copper SulfateSolvent

Procedure

One liter of a copper sulfate-sulfuric acid slurry was prepared by adding copper sulfate pentahydrate crystals to an aqueous solution which contained 15 percent by volume free sulfuric acid (66° Baume) and was saturated in copper sulfate at 67° F. (29.2 g/l Cu). Initially at rest, the crystal fraction comprised about 40 percent of the total slurry volume. This slurry was agitated mechanically and heated to 150° F. while copper was plated at a current density of 160 amps per square foot. A stainless steel cathode was used with lead anodes. After one hour of plating under these conditions, the cathode was removed and inspected. The copper deposit was relatively smooth and fine grained in nature.

Workup

  1. customthe cathode was removed

Sources & evidence

ORD record
ord-0ca82fabeaae4bd38a5c99ef97beee2a
Source dataset
uspto-grants-1979_08
Patent number
US04164456

Reaction notes

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