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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 622154Generated: October 30, 2026

Trifluoromethanesulfonic acid → Fluoren-1-amine

https://huagongshe.com/reaction/622154

Reaction equation

Participants

RoleNameHCIDCharge
ReactantTrifluoromethanesulfonic acidHCID 62406—
Reactant4,4'-(9H-Fluorene-9,9-diyl)bis(2-methylaniline)HCID 21872150—
ReactantHCID 54681982HCID 54681982—
ReactantHCID 85771059HCID 85771059—
ReactantHCID 178437635HCID 178437635—
ProductFluoren-1-amineHCID 22817—

Reaction Steps

An adhesive of the present invention was made by mixing together 25 parts of PKHS, a phenoxy resin from the Union Carbide Corporation, 52 parts of Quatrex 1010, a diglycidyl ether of bisphenol A epoxy resin from the Dow Chemical Company, and 23 parts of 9,9-bis(3-methyl-4-aminophenyl)fluorene (hereinafter BAFOT). These three constituents were stirred to a uniform paste, using methyl ether ketone (MEK) as a solvent for the solution of the phenoxy and epoxy resins, followed by blending in the relatively insoluble BAFOT, and dilution of the resultant paste to 50% solids by weight with additional MEK. The fluorene-amine curative was prepared for dispersion in this epoxy resin system by jet milling to a mean particle size of <5 um. To this dispersion an accelerator, the triflic acid half salt of 2-ethyl-4-methylimidazole was added at a rate of 4 parts per hundred of the solids in the dispersion.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS04769399
Source datasetuspto-grants-1988_09
ORD IDord-c267c7146f2f4f0d916ebecedb9c3dda
Source noteuspto-grants-1988_09