HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 622154Generated: October 30, 2026
Trifluoromethanesulfonic acid → Fluoren-1-amine
https://huagongshe.com/reaction/622154
Participants
| Role | Name | HCID | Charge |
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| Reactant | Trifluoromethanesulfonic acid | HCID 62406 | — |
| Reactant | 4,4'-(9H-Fluorene-9,9-diyl)bis(2-methylaniline) | HCID 21872150 | — |
| Reactant | HCID 54681982 | HCID 54681982 | — |
| Reactant | HCID 85771059 | HCID 85771059 | — |
| Reactant | HCID 178437635 | HCID 178437635 | — |
| Product | Fluoren-1-amine | HCID 22817 | — |
Reaction Steps
An adhesive of the present invention was made by mixing together 25 parts of PKHS, a phenoxy resin from the Union Carbide Corporation, 52 parts of Quatrex 1010, a diglycidyl ether of bisphenol A epoxy resin from the Dow Chemical Company, and 23 parts of 9,9-bis(3-methyl-4-aminophenyl)fluorene (hereinafter BAFOT). These three constituents were stirred to a uniform paste, using methyl ether ketone (MEK) as a solvent for the solution of the phenoxy and epoxy resins, followed by blending in the relatively insoluble BAFOT, and dilution of the resultant paste to 50% solids by weight with additional MEK. The fluorene-amine curative was prepared for dispersion in this epoxy resin system by jet milling to a mean particle size of <5 um. To this dispersion an accelerator, the triflic acid half salt of 2-ethyl-4-methylimidazole was added at a rate of 4 parts per hundred of the solids in the dispersion.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
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| Patent number | US04769399 |
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| Source dataset | uspto-grants-1988_09 |
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| ORD ID | ord-c267c7146f2f4f0d916ebecedb9c3dda |
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| Source note | uspto-grants-1988_09 |
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