Methyl Methacrylate → Butyl Acrylate

HRID 854591Notes

Reaction equation

HRID 854591 reaction equation
C(OC)(=O)C(C)=C.[Na].S([CH:13]([CH2:25]C(OCCCCCCCC)=O)[C:14]([O:16][CH2:17][CH2:18][CH2:19][CH2:20]CCCC)=[O:15])(O)(=O)=O.[Al]>>[C:14]([O:16][CH2:17][CH2:18][CH2:19][CH3:20])(=[O:15])[CH:13]=[CH2:25]

Participants

4

Reactant 3

HCID 6658Methyl MethacrylateHCID 5359268AluminumHCID 53249634Butanedioic acid, 2-sulfo-, 1,4-dioctyl ester, sodium salt (1:1)

Product 1

HCID 8846Butyl Acrylate

Procedure

Using the emulsion polymerization process described above for the two stage copolymer, a two stage copolymer composed of methyl methacrylate: butyl acrylate ratio of 60:40 was synthesized to yield a polymer latex with 204 nm average particles (no clay). The emulsifier used in the polymerization process was 1.28% of a 75% solution of dioctyl sulfosuccinate sodium salt. The total solids content of the emulsion was 48.55 weight percent. A portion of the emulsion was coated onto a 0.002 cm thick aluminum sheet to yield a 0.069 cm thick film. The entire arrangement of film and substrate was dried overnight in a vacuum oven at 75° C. After drying a disk of surface area 2.7318 cm2 was cut from the laminate and evaluated, by dielectric relaxation spectroscopy., for assessment of the magnitude of the dielectric storage factor. The data listed in TABLE VI, reveal the value of the dielectric storage factor. A list of the mechanical properties are given in TABLE VII.

Workup

  1. customthe emulsion polymerization process
  2. customto yield a polymer latex with 204 nm average particles (no clay)
  3. customto yield a 0.069 cm thick film
  4. customThe entire arrangement of film and substrate was dried overnight in a vacuum oven at 75° C
  5. customAfter drying a disk of surface area 2.7318 cm2

Sources & evidence

ORD record
ord-d3d40b1e38a643e5a88c0df992ce7946
Source dataset
uspto-grants-2007_08
Patent number
US07259203B2

Reaction notes

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