1745-89-7C=CCc1cc(C(C)(C)c2ccc(O)c(CC=C)c2)ccc1OWOCGGVRGNIEDSZ-UHFFFAOYSA-N安全情報は参考情報です。供給元の安全データシート(SDS)、適用法令、専門家による評価に代わるものではありません。
This chemical does not meet GHS hazard criteria for 2.6% (4 of 155) of reports.
Danger
H314 (97.4%): Causes severe skin burns and eye damage [Danger Skin corrosion/irritation]
P260, P261, P264, P264+P265, P272, P273, P280, P301+P330+P331, P302+P352, P302+P361+P354, P304+P340, P305+P354+P338, P316, P317, P321, P333+P317, P362+P364, P363, P391, P405, and P501 (click each P-code to see the statement)
Aggregated GHS information provided per 155 reports by companies from 10 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.
Danger
Chemical: Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)-
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)- is listed on the EPA's Chemical Data Reporting (CDR) system. Manufacturers and importers of Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)- are required to report information about their production and use of this chemical to the EPA under the Toxic Substances Control Act (TSCA). (40 eCFR Part 711)
Status: Active Update: 11-01-2023 https://echa.europa.eu/registration-dossier/-/registered-dossier/12478
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propenyl)-: Does not have an individual approval but may be used under an appropriate group standard
Skin Corr. 1B (97.4%)
Skin corrosion - category 1
Adhesive Manufacturing
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)-: ACTIVE
用途合成樹脂添加剤、液晶原料、感光剤、情報記録剤。
使用diallyl bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., and it can enhance the toughness of thermosetting resin greatly. It also can be used as actively diluent of thermosetting resin. The adhesion strength between metal can be further improved when used in rubber.
一般的な説明2,2′-Diallylbisphenol A (DABA) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material. It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
読み込み中…
1745-89-7DTXSID1061942CHEMBL230240