Succinic Acid → Epoxysuccinic acid
反応式
[C:1]([OH:8])(=[O:7])[CH2:2][CH2:3][C:4]([OH:6])=[O:5].C(N(CCCC)CCCC)CCC.C(C(C)=[O:25])C>>[O:25]1[CH:2]([C:1]([OH:8])=[O:7])[CH:3]1[C:4]([OH:6])=[O:5]参加物
4
反応条件
- 温度
- 150 °C
実験手順
A reaction vessel was charged with 442 parts Epoxy B, 442 parts Epoxy E, 116.0 parts succinic acid, 110 parts methyl ethyl ketone, and 3 parts tri-n-butylamine (catalyst). The temperature was raised to 150° C., while removing sufficient MEK (100 parts) to maintain controlled reflux at this temperature. The reaction maintained at 150° C., for 1.5 l hours and then poured into a poly(tetrafluoroethylene) lined tray and allowed to cool to ambient temperature. The resulting solid resin had an acid number of 32.0 and an epoxy content of 0.03 meq./g.
後処理
- customwhile removing sufficient MEK (100 parts)
- temperatureto maintain
- temperaturecontrolled reflux at this temperature
- temperatureThe reaction maintained at 150° C., for 1.5 l hours
- additionpoured into a poly(tetrafluoroethylene) lined tray
- temperatureto cool to ambient temperature
出典と根拠
- ORDレコード
- ord-448d8dff98184a3088c411fe06c20c69
- 出典データセット
- uspto-grants-1979_12
- 特許番号
- US04179440
反応ノート
読み込み中…