1745-89-7C=CCc1cc(C(C)(C)c2ccc(O)c(CC=C)c2)ccc1OWOCGGVRGNIEDSZ-UHFFFAOYSA-N1745-89-7DTXSID1061942CHEMBL230240안전 정보는 참고용이며, 공급업체의 물질안전보건자료(SDS), 관련 법규 및 전문가 평가를 대체하지 않습니다.
This chemical does not meet GHS hazard criteria for 2.6% (4 of 155) of reports.
Danger
H314 (97.4%): Causes severe skin burns and eye damage [Danger Skin corrosion/irritation]
P260, P261, P264, P264+P265, P272, P273, P280, P301+P330+P331, P302+P352, P302+P361+P354, P304+P340, P305+P354+P338, P316, P317, P321, P333+P317, P362+P364, P363, P391, P405, and P501 (click each P-code to see the statement)
Aggregated GHS information provided per 155 reports by companies from 10 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.
Danger
Chemical: Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)-
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)- is listed on the EPA's Chemical Data Reporting (CDR) system. Manufacturers and importers of Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)- are required to report information about their production and use of this chemical to the EPA under the Toxic Substances Control Act (TSCA). (40 eCFR Part 711)
Status: Active Update: 11-01-2023 https://echa.europa.eu/registration-dossier/-/registered-dossier/12478
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propenyl)-: Does not have an individual approval but may be used under an appropriate group standard
Skin Corr. 1B (97.4%)
Skin corrosion - category 1
Adhesive Manufacturing
Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propen-1-yl)-: ACTIVE
용도diallyl bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., and it can enhance the toughness of thermosetting resin greatly. It also can be used as actively diluent of thermosetting resin. The adhesion strength between metal can be further improved when used in rubber.
일반 설명2,2′-Diallylbisphenol A (DABA) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material. It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
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